Topa Thermal at LogiPharma 2026: What we’re bringing to Vienna
Advances in thermal‑packaging engineering: what Topa Thermal will present in Vienna
Topa Thermal will be attending LogiPharma 2026, taking place 14–16 April at the Austria Center Vienna, where global leaders in pharmaceutical supply chain and logistics will gather to explore the sector’s evolving challenges and emerging solutions.
With renewed focus on qualification expectations, freight‑weight pressures, sustainability priorities and increasingly variable real‑world routes, LogiPharma provides a timely platform for organisations to review how temperature‑controlled packaging is adapting to meet future demands.
As part of this programme, Topa Thermal will share key developments and be available for in‑depth conversations throughout the conference.
“I’m excited to return to LogiPharma. The conversations are honest and detailed, and they help us understand exactly where customers are feeling the pressure – whether it’s qualification demands, freight weight or route variability. These insights feed directly into the solutions we bring to market.” – Jacques le Comte, Business Development Manager, Topa Thermal.
Across all three days, delegates will find the Topa Thermal team at Booth 72, in the Container Zone (C23) and during the Innovation Zone showcase on Day 2, where a first preview of a forthcoming pallet‑scale development will be presented by Product Director Richard Harrop.
In addition to this preview, Topa Thermal will highlight advancements across its established Connex thermal solutions portfolio. This includes updates to Connex 7D, guided by Technical Solutions Manager Maarten Kleverlaan, as the extended‑duration parcel shipper enters early adoption. Developed for long‑distance and high‑variability routes, Connex 7D is designed to reduce touchpoints, support consistent handling, and deliver more predictable thermal behaviour under pressure.For teams exploring critical small‑parcel solutions, Ezcode – led by Business Development Manager Patrick Müller — will also feature in discussions. Ezcode’s press‑activated, self‑cooling technology supports decentralised trials, diagnostic kits and infrastructure‑limited environments, offering dependable 2–8°C performance at the press of a button.
LogiPharma delegates will also be able to benchmark Connex Overwrap, Topa Thermal’s freight‑efficient pallet shipper designed to help organisations reduce billable weight and CO₂ impact without compromising thermal performance or payload volume.
Throughout the event, Sales Director Paul Theuns and the wider Topa Thermal team will be available to discuss emerging operational pressures, compare system footprints and weight performance, and explore shifts toward more reusable and streamlined thermal‑packaging approaches. Whether organisations are reviewing parcel systems, evaluating pallet‑shipper options or planning for long‑term thermal‑strategy transitions, LogiPharma provides an ideal setting to engage directly with the people behind Topa Thermal’s latest developments.
Jacques le Comte, Business Development Manager, Topa Thermal
“I’m excited to return to LogiPharma. The conversations are honest and detailed, and they help us understand exactly where customers are feeling the pressure – whether it’s qualification demands, freight weight or route variability. These insights feed directly into the solutions we bring to market.”